Apic Yamada Corporation manufactures and sells semiconductor packaging equipment and mold dies, trimming/forming equipment and tools, and singulation dicers and test handlers in Japan and internationally. It offers molding systems, including large panel compression molding systems, automated cavity direct injection molding systems, fully automated WLP and WLP/PLP molding systems, liquid transfer encapsulation systems, strip compression molding systems, high performance molding systems, and compact manual molding systems, as well as molding systems for low/medium production and large scale ECU. The company also provides handlers comprising auto device mount systems, high-speed package transport systems, and automated tape reel changers, as well as tape-and-reel test handlers with an automatic reel changer. In addition, it offers trims and form systems; and precision die-sets consisting of stamping/trim and form die sets. The company was formerly known as Yamada Mfg. Co., Ltd. and changed its name to Apic Yamada Corporation in April 1993. Apic Yamada Corporation was founded in 1950 and is headquartered in Chikuma, Japan. As of June 27, 2019, Apic Yamada Corporation operates as a subsidiary of Yamaha Motor Robotics Holdings Co., Ltd.